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Mark Johnson

Head of Electrical Systems and Optics Research Division and Professor of Advanced Power Conversion, Faculty of Engineering

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Biography

Professor C Mark Johnson received the BA degree in engineering and the PhD degree in electrical engineering from the University of Cambridge, UK, in 1986 and 1991 respectively.

From 1990 to 1992 he was a Research Associate at the University of Cambridge and in 1992 he was appointed Lecturer at the University of Newcastle, UK, where his research included the design, analysis and characterisation of power semiconductor devices, resonant power conversion and instrumentation.

From 1998 to 2001 he managed the UK national programme on Silicon Carbide electronics and in 2000 he became Reader of Power Electronics at the University of Newcastle. In 2003, Professor Johnson was appointed as Rolls-Royce/RAEng Research Professor of Power Electronic Systems at the University of Sheffield and in 2006 he was appointed to a personal chair at the University of Nottingham, where he leads research into power semiconductor devices, power device packaging, reliability, and thermal management, power module technologies and power electronic applications.

He is a member of the executive committee of the UK Innovative Electronics Manufacturing Research Centre (IeMRC) and is project manager for the Flagship Project in Power Electronics. Professor Johnson is a member of the executive of the IET Power Generation, Conversion and Utilisation Technical and Professional Network.

Research Summary

Professor Johnson is currently researching:

  • Power semiconductor devices
  • Power device packaging, reliability, and thermal management
  • Power module technologies
  • Power electronic applications
  • Renewable energy technologies; distributed generation
  • Thermoacoustics.

Selected Publications

  • MUSALLAM, MAHERA and JOHNSON, C MARK, 2011. Impact of different control schemes on the life consumption of power electronic modules for variable speed wind turbines In: EPE 2011.
  • EVANS, PAUL, TEERAKAWANICH, NITHIPHAT and JOHNSON, C MARK, 2011. Active control of series connected, voltage driven power devices using a single gate drive In: EPE 2011.
  • AGYAKWA, PA, CORFIELD, MR, YANG, L, LI, JF, MARQUES, VMF and JOHNSON, CM, 2011. Microstructural Evolution Of Ultrasonically Bonded High Purity Al Wire During Extended Range Thermal Cycling Microelectronics Reliability. 51(2), 406-415
  • LI, JF, AGYAKWA, PA and JOHNSON, CM, 2011. Interfacial Reaction In Cu/Sn/Cu System During The Transient Liquid Phase Soldering Process Acta Materialia. 59(3), 1198-1211
  • YANG, L, AGYAKWA, PA and JOHNSON, CM, 2011. A Time-Domain Physics-Of-Failure Model For The Lifetime Prediction Of Wire Bond Interconnects Microelectronics Reliability. 51(9-11), 1882-1886
  • CASTELLAZZI, A., SOLOMON, A., AGYAKWA, P., LI, J., TRENTIN, A. and JOHNSON, C. M., 2010. High power density, low stray inductance, double sided cooled matrix-converter type switch In: 2010 International Power Electronics Conference (IPEC).
  • AGYAKWA, P., CORFIELD, M., LI, J., JOHNSON, C., HOGG, S., LIOTTI, E. and LOH, W., 2010. Unusual Observations in the Wear-out of High Purity Aluminium Wire Bonds under Extended Range Passive Thermal Cycling IEEE Transactions on Device and Materials Reliability.
  • MATTEY, N., SKURIAT, R., LI, J., AGYAKWA, P., EVANS, P. and JOHNSON, C.M., 2010. Thermal and mechanical design optimization of a pressure-mounted base-plate-less high temperature power module In: Electronic System-Integration Technology Conference (ESTC), 13-16 Sept. 2010.
  • WIJEKOON, T., ABDESSELAM, F., CASTELLAZZI, A., JOHNSON, M., PICCO, N. and WHEELER, P., 2010. Optimum Component Technology Selection for an Expulsive Wing De-Icing System In: PEMD 2010.
  • EVANS, P., CASTELLAZZI, A., CARASTRO, F. and JOHNSON, C.M., 2010. A computationally efficient electro-thermal modelling technique for coupled Multi-Disciplinary Analysis of Multi-Chip Power Modules In: 2010 22nd International Symposium on Power Semiconductor Devices & IC's (ISPSD), 6-10 June 2010. 297-300
  • ABDESSELAM, F., WIJEKOON, T., CASTELLAZZI, A., JOHNSON, M. and WHEELER, P., 2010. Design of an expulsive de-icing system for avionic applications: preliminary study and functional tests In: IEEE ICIT.
  • MUSALLAM, M., JOHNSON, C.M., YIN, C., BAILEY, C. and MERMET-GUYENNET, M., 2010. Real-time life consumption power modules prognosis using on-line rainflow algorithm in metro applications In: ECCE 2010.
  • RILEY, P.H., SAHA, C. and JOHNSON, C. M., 2010. Designing a Low-Cost, Electricity-Generating Cooking Stove At: Technology and Society Magazine
  • MUSALLAM, M. and JOHNSON, M., 2010. Real-Time Compact Thermal Models for Health Management of Power Electronics IEEE Transactions on Power Electronics.
  • YIN, C.Y., LU, H., MUSALLAM, M., BAILEY, C. and JOHNSON, C.M, 2010. In-service reliability assessment of solder interconnect in power electronics modules In: Prognostics and Health Management Conference, 2010. PHM '10. 1-5
  • EVANS, P. and JOHNSON, M., 2010. Fast Extraction of Dynamic Thermal Impedance for Multi-Chip Power Modules In: CIPS 16-18 Mar 2010.
  • AGYAKWA, PA, CORFIELD, MR, LI, JF, LOH, WS, LIOTTI, E, HOGG, SC and JOHNSON, CM, 2010. Unusual Observations In The Wear-Out Of High-Purity Aluminum Wire Bonds Under Extended Range Passive Thermal Cycling Ieee Transactions On Device And Materials Reliability. 10(2), 254-262
  • LI, JF, AGYAKWA, PA and JOHNSON, CM, 2010. Kinetics Of Ag3sn Growth In Ag-Sn-Ag System During Transient Liquid Phase Soldering Process Acta Materialia. 58(9), 3429-3443
  • LI, JF, AGYAKWA, PA and JOHNSON, CM, 2010. A Fixed-Grid Numerical Modelling Of Transient Liquid Phase Bonding And Other Diffusion-Controlled Phase Changes Journal Of Materials Science. 45(9), 2340-2350
  • LI, JF, AGYAKWA, PA, JOHNSON, CM, ZHANG, D, HUSSAIN, T and MCCARTNEY, DG, 2010. Characterization And Solderability Of Cold Sprayed Sn-Cu Coatings On Al And Cu Substrates Surface & Coatings Technology. 204(9-10), 1395-1404
  • YIN, CY, LU, H, MUSALLAM, M, BAILEY, C and JOHNSON, CM, 2010. In-Service Reliability Assessment Of Solder Interconnect In Power Electronics Modules
  • CARASTRO, F., CLARE, J., CASTELLAZZI, A., JOHNSON, M., BLAND, M. and WHEELER, P, 2009. POWER DEVICE RELIABILITY ASSESSMENT IN HIGH PULSED POWER In: ECCE 2009.
  • CARASTRO, F., BLAND, M., CASTELLAZZI, A., CLARE, J. C., JOHNSON, C. M. and WHEELER, P. W., 2009. Investigation of the electro-thermal stress affecting IGBT modules in high-pulsed power resonant converters In: IET European Pulsed Power Conference, 2009. 1-4
  • CARASTRO, F., CLARE, J. C., BLAND, M. J., JOHNSON, C. M. and WHEELER, P. W., 2009. Development and power device reliability assessment of resonant pulsed power converters for RF applications In: High Power RF Technologies, 2009. 1-5
  • MUSALLAM, M., JOHNSON, M., YIN, C., LU, H. and BAILEY, C., 2009. Real-Time Comparison of Power Module Failure Modes under In-Service Conditions In: EPE 2009.
  • CASTELLAZZI, A., JOHNSON, M. and MERMET-GUYENNET, M., 2009. Computation of realistic 3D temperature fields in the circuit simulation of power components and systems In: IMPAS 2009.
  • CASTELLAZZI, A., JOHNSON, M., PITON, M. and MERMET-GUYENNET, M, 2009. Experimental analysis and modeling of multi-chip IGBT modules short-circuit behavior In: IEEE 6th International Power Electronics and Motion Control Conference, 2009. IPEMC '09. 285-290
  • SOLOMALA, P., CASTELLAZZI, A., MERMET-GUYENNET, M. and JOHNSON, M., 2009. New technology and tool for enhanced packaging of semiconductor power devices In: IEEE International Symposium on Industrial Electronics, 2009. ISIE 2009. 2020-2025
  • SKURIAT, R. and JOHNSON, M., 2009. Direct Substrate Cooling of Power Electronics In: EPE 2009.
  • HUA LU, WEI-SUN LOH, BAILEY, C. and JOHNSON, C.M., 2009. Computer modelling analysis of the globtop’s effects on aluminium wirebond reliability In: Electronics System-Integration Technology Conference, 1-4 Sept. 2008.
  • RIZVI, M.J., SKURIAT, R., TILFORD, T., BAILEY, C., JOHNSON, C.M. and LU, H, 2009. Modelling of jet-impingement cooling for power electronics In: 10th International Conference on Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems, 2009. EuroSimE 2009. 1-5
  • HUA LU, RIDOUT, S., BAILEY, C., WEI SUN LOH, AGYAKWA, P. and JOHNSON, M., 2008. Computer simulation of crack propagation in power electronics module solder joints In: Electronic Packaging Technology & High Density Packaging, 28-31 July 2008.
  • JOHNSON, C.M, CLARE, J. and ASHER, G, 2008. Challenges for Power Electronics in Future Electricity Networks In: International Conference and Exhibiotion on High Temperature Electronics (HiTEC 2008). 133-140
  • YIN, C.Y., LU, H., MUSALLAM, M., BAILEY, C. and JOHNSON, C.M, 2008. A Physics-of-failure based Prognostic Method for Power Modules In: Electronics Packaging Technology Conference, 2008. 1190-1195
  • YIN, C.Y., LU, H., MUSALLAM, M., BAILEY, C. and JOHNSON, C.M., 2008. A prognostic assessment method for power electronics modules In: Electronics System-Integration Technology Conference, 2008, 1-4 Sept. 2008.
  • MUSALLAM, M., JOHNSON, C.M., CHUNYAN YIN, HUA LU and BAILEY, C., 2008. Real-time life expectancy estimation in power modules In: Electronics System-Integration Technology Conference, 1-4 Sept. 2008.
  • MUSALLAM, M. and JOHNSON, C.M., 2008. Monitoring through-life thermal path degradation using real time thermal models In: Power Electronics Specialists Conference, 15-19 June 2008.
  • SKURIAT, ROBERT, JOHNSON, C. M. and , 2008. Thermal performance of baseplate and direct substrate cooled power modules In: 4th IET Conference on Power Electronics, Machines and Drives, 2008. 548-552
  • HUA LU, WEI-SUN LOH, BAILEY, C. and JOHNSON, C.M, 2008. Computer Simulation of Aluminium Wirebonds with Globtop in Power Electronics Modules In: Microsystems, Packaging, Assembly & Circuits Technology Conference, 2008. 348-351
  • BUTTAY,C., JOHNSON, C.M., RASHID, J., UDREA, F., AMARATUNGA, G.A.J., TAPPIN, P., WRIGHT, N., IRELAND, P., YAMAMOTO, T., TAKEUCHI, Y. and MALHAN, R.K., 2007. High temperature direct double side cooled inverter module for hybrid electric vehicle application Materials Science Forum. 556-557, 709-712
  • MUSALLAM, M., ACARNLEY, P. P., JOHNSON, C. M., PRITCHARD, L. and PICKERT, V., 2007. Estimation and control of power electronic device temperature during operation with variable conducting current: Circuits, Devices & Systems, IET Circuits, Devices & Systems, IET. 1(2), 111-116
  • MUSALLAM, MAHERA, BUTTAY, CYRIL, JOHNSON, C MARK, BAILEY, CHRIS and WHITEHEAD, MICHAEL, 2007. Reduced Order Electro-Thermal Models for Real-Time Health Management of Power Electronics In: International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, 2007. EuroSime 2007. 1-6
  • YOUNG, J. L., ADA, R. S., O'NEIL, B. and JOHNSON, C. M., 2007. Bandwidth Optimization of an Integrated Microstrip Circulator and Antenna Assembly: Part 2: Antennas and Propagation Magazine, IEEE Antennas and Propagation Magazine, IEEE. 49(1), 82-91
  • JOHNSON, C. M., BUTTAY, C., RASHID, S. J., UDREA, F., AMARATUNGA, G. A. J., IRELAND, P. and MALHAN, R. K., 2007. Compact Double-Side Liquid-Impingement-Cooled Integrated Power Electronic Module: Power Semiconductor Devices and IC's, 2007. ISPSD '07. 19th International Symposium on In: Power Semiconductor Devices and IC's, 2007.ISPSD '07.19th International Symposium on,. 53-56
  • BUTTAY, C, JOHNSON, M, MUSALLAM, M and WHITEHEAD, M, 2007. Real-Time Compact Electronic Thermal Modelling for Health Monitoring In: EPE 2007: 12th European Conference on Power Electronics and Applications.
  • BUTTAY, C., RASHID, J., JOHNSON, C.M., UDREA, F., AMARATUNGA, G., IRELAND, P. and MALHAN, R.K, 2007. Compact Inverter Designed for High-Temperature Operation In: Power Electronics Specialists Conference, 2007. PESC 2007. IEEE. 2241-2247
  • BUTTAY, C, RASHID, J, MALHAN, R.K., JOHNSON, M, UDREA, F, IRELAND, P and AMARATUNGA, G, 2007. High performance cooling system for automotive inverters In: EPE 2007: 12th European Conference on Power Electronics and Applications. (In Press.)
  • ATKINSON, DAVID, ARMSTRONG, MATTHEW, JOHNSON, MARK and LAKIN, TONY, 2007. Grid Connected Converter Control In: IET Power Convention, 2007. 1-21
  • VASSILEVSKI, K.V., NIKITINA, I.P., WRIGHT, N.G., HORSFALL, A.B., O'NEILL A.G. and JOHNSON, C.M., 2006. Device processing and characterisation of high temperature silicon carbide Schottky diodes Microelectronic Engineering. 83(1), 150-154
  • WHITEHEAD, M. J. and JOHNSON, C. M., 2006. Junction Temperature Elevation as a Result of Thermal Cross Coupling in a Multi-Device Power Electronic Module In: Electronics Systemintegration Technology Conference, 2006.1st. 1218-1223
  • ARMSTRONG, M., ATKINSON, D. J., JOHNSON, C. M. and ABEYASEKERA, T. D., 2006. Auto-Calibrating DC Link Current Sensing Technique for Transformerless, Grid Connected, H-Bridge Inverter Systems Power Electronics, IEEE Transactions on. 21, 1385-1393
  • ADACHI, K., TAKAO, K., OHASHI, H. and JOHNSON, C. M., 2006. Elucidation of the intrinsic loss arising from switch output capacitance coss in ultra-high-speed low-loss power converters Circuits, Devices and Systems, IEE Proceedings-. 153, 40-45
  • FORREST, S. J., WANG, J., JEWELL, G. W., JOHNSON, C. M. and CALVERLEY, S. D., 2006. Analysis of an AC fed direct converter for a switched reluctance machine in aerospace applications In: Power Electronics and Motion Control Conference, 2006.IPEMC '06.CES/IEEE 5th International,. 1-6
  • ABEYASEKERA, T., JOHNSON, C.M., ATKINSON, D.J. and ARMSTRONG, M, 2005. Suppression of line voltage related distortion in current controlled grid connected inverters IEEE Transactions on Power Electronics. 20(6), 1393-1401
  • ARMSTRONG, M., ATKINSON, D. J., JOHNSON, C. M. and ABEYASEKERA, T. D., 2005. Low order harmonic cancellation in a grid connected multiple inverter system via current control parameter randomization Power Electronics, IEEE Transactions on. 20, 885-892
  • PRITCHARD, L.S., ACARNLEY, P.P. and JOHNSON, C.M., 2004. Effective thermal conductivity of porous solder layers IEEE Transactions on Components and Packaging Technologies. 27(2), 259-267
  • GLEW, J.P., FORSYTH, A.J., WESTMANCOTT, O.J., WALLACE, W.F., JOHNSON, C.M., NAYLOR, P. and CLARE, J.C., 2001. Masters Level Training in Power Electronics Machines and Drives by Flexible Learning In: EPE Conference: Tomorrow''s Education in Electrical Technologies: Revisited Method and Tools for Renewed Motivation.
  • GLEW, J.P., FORSYTH, A.J., WESTMANCOTT, O.J., WALLACE, W.F., JOHNSON, C.M., NAYLOR, P. and CLARE, J.C., 2001. Creation of Web Based Learning Materials for an MSc in Power Electronics and Drives In: Proceedings of the European Conference on Power Electronics and Applications EPE 2001.
  • MUSALLAM, M., JOHNSON, C.M., CHUNYAN YIN, HUA LU and BAILEY, C., In-service life consumption estimation in power modules In: EPE 2008.
  • BUTTAY, C, JOHNSON, C. M, RASHID, J, UDREA, F, AMARATUNGA, G. A. J, TAPPIN, P, WRIGHT, N, IRELAND, P, YAMAMOTO, T, TAKEUCHI, Y and MALHAN, R.J, High Temperature Direct Double Side Cooled Inverter Module for Hybrid Electric Vehicle Application In: Materials Science Forum. (In Press.)
  • LOH, W. S., NG, B. K., NG, J. S., SOLOVIEV, S. I., CHA, H.-Y., SANDVIK, P. M., JOHNSON, C. M., DAVID, J. P. R. and , Impact Ionization Coefficients in 4H-SiC IEEE Transactions on Electron Devices. 55(8), 1984-1990

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