Developing a polyimide formulation

Work which cuts across both our RC3 and RC4, on developing a polyimide formulation to inkjet electronics for high temperature applications, has been published in Additive Manufacturing

(https://www.scopus.com/record/display.uri?eid=2-s2.0-85057611632&doi=10.1016%2fj.addma.2018.11.017&origin=inward&txGid=565456cc6c368dc51f2ba6e70fa707aa)